ABLEBOND(reg) 8510 fast-cure die attach adhesive is for use in plastic ball-grid-array packages. The adhesive adheres to laminate, solder mask, or gold surfaces, resists delamination from moisture in BGA laminate packages, and reduces cycle time. Technical bulletin provides information on the adhesive's properties.
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When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
Traditional dev kits are based on a manufacturer’s microcontroller, radio module, or sensor device. The idea is to aid the design engineer in developing his or her own IoT prototype as quickly as possible. A not-so-traditional IoT development kit released by Bosch aims to simplify IoT prototyping even further.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.