The world of semiconductors, displays, computers, printers, cell phones, personal digital assistants (PDAs), circuit boards, and many other electronic devices may soon experience a paradigm shift away from silicon chips, according to Glenn Sanders, VP of development at Rolltronics. The company has pioneered a new approach to electronics manufacturing by producing thin-film electronic devices on flexible substrates using roll-to-roll manufacturing techniques. "The first applications will probably involve flexible back planes for IT and PDA devices," says Sanders. Using roll-to-roll manufacturing, Rolltronics plans to work with private companies developing Internet devices, medical imaging equipment, electronic ID tags, electronic books and paper, and a variety of other "transformational" products. Other potential applications include logic, wireless, power, memory, and display components. The devices are constructed as a "sandwich" of five or six thin layers (such as the plastic used in overhead transparencies) laminated into a single unit. "We're still in the prototyping phase, but we expect to have test units in a year and small production quantities in 18 months," says Sanders. For more information, visit the Rolltronics web site at www.rolltronics.com.
A simple new chemical method for repairing and recycling notoriously difficult carbon fiber composites has been developed by the Fraunhofer Institute for Applied Polymer Research. An entire component can be completely recycled, including reclaiming its expensive carbon fibers for reuse.
In today’s connected world we are seeing the beginning of connected homes, smart grids, self-driving automobiles, drones, and many other amazing devices. Out of all the soon-to-be connected devices, which device poses the greatest dangerous to its users and society?
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