3M Aerospace is now shipping a thermosetting, modified epoxy adhesive film designed for composite and metal bonding in aerospace manufacturing.
The ability of Scotch-Weld Structural Adhesive Film AF 555 to resist pre-bond humidity is key for the construction of composite aircraft since composites can absorb up to 3 percent of their weight in moisture from the environment. The adhesive is a low volatile organic compound with a 350 F curing temperature that offers an extended out-time and outstanding pre-bond humidity resistance.
3M is also introducing a similar low VOC adhesive film for composite and metal bonding, Scotch-Weld Structural Adhesive Film AF 500. It is designed for use in 250F curing applications.
Both have enhanced shop handling capabilities. AF 555 has a 120-day out-time, reducing adhesive scrap while offering consistent performance. AF 500 has a 45-day out-time. Both are conformable to complex surfaces, and stay in place on a vertical substrate.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This radio show will show what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.