3M Aerospace is now shipping a thermosetting, modified epoxy adhesive film designed for composite and metal bonding in aerospace manufacturing.
The ability of Scotch-Weld Structural Adhesive Film AF 555 to resist pre-bond humidity is key for the construction of composite aircraft since composites can absorb up to 3 percent of their weight in moisture from the environment. The adhesive is a low volatile organic compound with a 350 F curing temperature that offers an extended out-time and outstanding pre-bond humidity resistance.
3M is also introducing a similar low VOC adhesive film for composite and metal bonding, Scotch-Weld Structural Adhesive Film AF 500. It is designed for use in 250F curing applications.
Both have enhanced shop handling capabilities. AF 555 has a 120-day out-time, reducing adhesive scrap while offering consistent performance. AF 500 has a 45-day out-time. Both are conformable to complex surfaces, and stay in place on a vertical substrate.
For more information, go to http://rbi.ims.ca/4933-510.