Reducing the need for double-sided circuit boards and slashing soldering requirements can lower product costs. Aromat Corporation's new NAiS(reg) "Feed-Through" board-to-board connectors achieve that by mounting the header in an opening in a single-side printed-circuit board. Stacking height is thus reduced along with the number of soldered connections needed. With a contact pitch of 0.8 mm, the Feed-Through series is part of the company's narrow-pitch board-to-board family. Bellows-type contacts, with resilient, wide, rounded corners, enhance reliability because of their flexibility, which absorbs torsion from impacts. A proprietary thin film on the gold-plated contacts provides corrosion resistance and extended insertion/removal life. The connectors are rated for 60V ac/dc and 0.5A, and have an insulation resistance of 1,000 MV. Aromat Corporation: Product Code 4163
Boeing continues to tweak the design of its 737 Max to add fuel efficiency to the next-generation jetliner with a change in the size of fan on the plane’s CFM LEAP-1B engine.
With its QuickPack print engine technology, easy-to-use preprocessing software, and hands-free cleaning system, Stratasys' Mojo is taking professional-grade 3D printing to a new level.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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