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Randy Frank
4/4/2005 Post a comment

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Semiconductor-based imaging sensors are coming on strong today, thanks to new advanced features, reduced power consumption, and lower costs. Design engineers are increasingly finding ways to apply the technology in a whole range of products, including cell phones, digital still cameras, PC cameras, cars, security and surveillance systems, bar code readers, medical devices, and even toys.

Image sensors are based on either CCD (charge-coupled device) or CMOS technology. High-performance imaging sensors (with resolutions of 5 megapixels or more) rely on CCD semiconductor technology, while low-cost imaging has historically been associated with CMOS technology.

However, the lines have begun to blur now that advancements in CMOS have extended its capability to up to 5 megapixels.

High and ultra-high performance applications continue to rely on CCD technology. Omron's F160-S2 double-speed camera, for example, can perform measurements as fast as 3 msec. Likewise, Keyence's CV-2600 Series camera provides ultra-high accuracy detection with a 2 million pixel CCD. Sub-pixel processing and image digitization offers repeatability down to ±0.05 pixels.

Advancements include increased integration at both the silicon and package level. For example, Phillips Semiconductor integrates a Video Graphics Array camera, a TFT display and driver, and its Nexperia mobile image processor into a single unit.

A typical imaging application requires three critical elements: the imaging sensor, an image processor, and an application processor. Some suppliers, such as STMicroelectronics make both the image sensor and the image processor—a chipset for mobile imaging. ST's STV0976 digital image processor supports its 1 megapixel Standard Mobile Imaging Architecture (SMIA) camera module at up to 15 frames per second (fps), or up to 30 fps with its Super Video Graphic Adapter (SVGA) unit.

Other suppliers provide dedicated image processing chips. For digital still cameras, TMS320DM270 processor from Texas Instruments integrates an 80 MHz ARM7 32-bit processor, a 90MHz TI C54x digital signal processor, and a 180 MHz single instruction, multiple data (SIMD) image processing engine for programmable image processing to support both CCD and CMOS image sensors. The engineer designing a vision system has several choices—what works best for a particular application will depend on the system performance and cost objectives.

The acompanying table compares some of the latest offerings in vision sensors and systems.

Vision Sensors and Systems
Supplier	Product	Part Number	Description	Target Applications	Resolution	Size	Module Size	Integrated Features	Power Consumption	Operating Temp Range	Other Key Specifications	Main Differentiating Factor(s)	Price
Micron http://rbi.ims.ca/4389-565	CMOS image sensor	MT9V022	System-on-a-chip (SOC) that combines both the image photoplane and the image processing of a video camera	Automotive lane departure warning, driver drowsiness detection systems, occupant sensing, blind spot detection, and general security	361,000-pixel VGA	752 × 480 array	9 mm × 9 mm 52-pin IBGA Package	On-chip timing, two-wire serial programmable interface, automatic gain and exposure control and auto black level calibration global shutter	&200 mW at maximum data rate	-40 to +85C	Enhanced near-IR sensitivity (greater than 40 percent QE at 850 nm), 26.6 MPS/26.6 MHz, optical format 1/3-inch, frame rate 60 fps	Designed for automotive applications, wide-VGA format, and a higher than normal dynamic range (>110dB)	$12 for 100K+ units
OmniVision Technologies Inc. http://rbi.ims.ca/4389-566	CMOS image sensor	OV5610	Color CMOS QSXGA (5.17 Megapixel) CAMERACHIP with OmniPixel Technology	Digital still cameras, PC camera/dual mode, video conference, machine vision, security cameras, biometrics, bar code scanners	5 megapixels	2,592 × 1,944 image array	14.22 mm × 14.22 mm	On-chip 10-bit A/D converter, can perform continuous digital zoom and in VGA resolution is capable of operating at 30 frames per sec (fps)	3.3V dc / 1.8V dc: Active 40 mA, Standby 10 µA	0 to +40C	Pixel Size 2.775 µm × 2.775 µm; 10-bit digital RGB raw data; max image transfer rate 4 fps	Proprietary pixel structure diminishes dark current to unnoticeable levels, a key factor in bringing CMOS image quality to CCD levels	$15 for 10K+ units
Philips Semiconductors http://rbi.ims.ca/4389-567	Nexperia mobile display module	n/a	Complete imaging and display solution for consumer camera phones: CMOS VGA camera, TFT display, display driver, and image processor	Mobile phone camera	5 megapixels	2,592 × 1,944 array of pixels	36.0 × 41.0 × 5.4 mm	CMOS VGA camera, Si TFT display (65k), color display driver (PCF8881), Philips Nexperia RAM-less Mobile Image Processor (PNX4000)	85 mA for backlight	-20 to +70C	n/a	Optimized design for cellular phones with reduced overall power consumption in standby mode	$20 to $30 depending on volume
Samsung Electronics Co. http://rbi.ims.ca/4389-568	CMOS image sensor	S5K3B1FX	2-megapixel CMOS image sensor features the industry's smallest 2.8 mm2 pixel size with a 1/3.2-inch optical format	Camera function in next-generation smart phones	2 megapixels	1,600 × 1,200 pixels	n/a	n/a	80 mW @ 15fps	-20 to +60C	Chip can realize a minimum illumination rating of 2 lux	Utilizes 0.13 micron process technology; Small lens size of 1/3.2 inches	$7 per unit in the second half of 2005
SMaL Camera Technologies http://rbi.ims.ca/4389-569	Ultra-Pocket 5 Rapid Development Kit	UP5	The first megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA)	Digital still camera	3 megapixels	2,000 × 1,500 pixels active array	6.75 mm × 5.08 mm sensor area	Autobrite 120 dB wide dynamic range for adapting to varying light conditions, electronic rolling shutter, on-chip 12-bit column parallel analog to digital converter	140 mW; Standby mode, &0.5 mW	-10 to +50C	1× to 16× digital gain, 8 or 12-bit digital output	High level of integration in ASIC and sensor, and autobrite wide dynamic range and longevity low power design	Available by customer request
STMicroelectronics http://rbi.ims.ca/4389-570	Megapixel SMIA camera module	VS6650	The first megapixel mobile-camera chipset, compliant with the Standard Mobile Imaging Architecture (SMIA)	Surveillance, PDAs, industrial, mobile phones	1 megapixel	1,152 × 864 array of pixels	9.5 × 9.5 × 7.6 mm	Three element 50-degree horizontal field of view lens, 10 bit A/D converter	85 mW operating, 30 µW standby	-25 to +55C	SMIA 1.0 profile 1 compliant imager, up to 30 frames per sec	Includes lens	$16 for the 1-megapixel kit
Toshiba America Electronic Components Inc. http://rbi.ims.ca/4389-571	CMOS image sensor camera module	TCM8230MD	Very small, thin VGA camera modules designed for camera-enabled compact cell phones. Unit incorporates a double lens and a single chip integrating a CMOS image sensor and a digital signal processor.	Cellular telephones, PDAs, and other portable equipment	330,000-pixel VGA	660 × 492 array of pixels with 1/6 of an inch optical format	6 mm (W) × 6 mm (D) × 4.5 mm (H)	Double lens and a single chip integrating a CMOS image sensor and a digital signal processor	40 mW at 30fps	-20 to +60C	Digital outputs: YUV = 4:2:2 or RGB Scanning: Progressive-scanning Frame rate: Maximum 30 frames per sec	Individual 3.75-microns pixels allows approximately 330,000 signal pixels on a single chip with a 1/6 of an inch optical format	$20 in 10K quantities

Web Resources
//Check out the links below for additional imaging resources//
CV-2600 Series vision system from Keyence: http://rbi.ims.ca/4389-559	F-16-S2 vision system from Omron: http://rbi.ims.ca/4389-560	Imaging sensors from Banner Engineering Corp.: http://rbi.ims.ca/4389-561
Imaging ICs from Atmel Corp.: http://rbi.ims.ca/4389-562	Image processor from Texas Instruments: http://rbi.ims.ca/4389-563

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