Design engineers continued to see new products aimed at facilitating heat dissipation, a particular concern as electronic devices are put into more compact packages while pushing more power. Announced at the show was Raychem's low-thermal-resistance HeatPath(TM) gel family. The conformable gel easily fills gaps between components and heat sinks with minimal pressure applied, thus avoiding damage to delicate parts. Eliminated are clamping systems and tight tolerance control ...Also debuting was the DC 2406KL series of fans from NMB Technologies. These light (45 g), small (60 X 60 X 15 mm) fans produce only 19 to 34 dB of noise. Preloaded, shielded ball bearings and variable speed control via a separate heat sensor increase fan lifetime.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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