Design engineers continued to see new products aimed at facilitating heat dissipation, a particular concern as electronic devices are put into more compact packages while pushing more power. Announced at the show was Raychem's low-thermal-resistance HeatPath(TM) gel family. The conformable gel easily fills gaps between components and heat sinks with minimal pressure applied, thus avoiding damage to delicate parts. Eliminated are clamping systems and tight tolerance control ...Also debuting was the DC 2406KL series of fans from NMB Technologies. These light (45 g), small (60 X 60 X 15 mm) fans produce only 19 to 34 dB of noise. Preloaded, shielded ball bearings and variable speed control via a separate heat sensor increase fan lifetime.
Two different shape-shifting polymers have been announced from two different universities: Wyss Institute at Harvard University and Zhejiang University in eastern China. Both of them change their shapes when immersed in water, and the one from Wyss Institute was made with 3D-printing techniques.
When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
Traditional dev kits are based on a manufacturer’s microcontroller, radio module, or sensor device. The idea is to aid the design engineer in developing his or her own IoT prototype as quickly as possible. A not-so-traditional IoT development kit released by Bosch aims to simplify IoT prototyping even further.
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