Design engineers continued to see new products aimed at facilitating heat dissipation, a particular concern as electronic devices are put into more compact packages while pushing more power. Announced at the show was Raychem's low-thermal-resistance HeatPath(TM) gel family. The conformable gel easily fills gaps between components and heat sinks with minimal pressure applied, thus avoiding damage to delicate parts. Eliminated are clamping systems and tight tolerance control ...Also debuting was the DC 2406KL series of fans from NMB Technologies. These light (45 g), small (60 X 60 X 15 mm) fans produce only 19 to 34 dB of noise. Preloaded, shielded ball bearings and variable speed control via a separate heat sensor increase fan lifetime.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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