Design engineers continued to see new products aimed at facilitating heat dissipation, a particular concern as electronic devices are put into more compact packages while pushing more power. Announced at the show was Raychem's low-thermal-resistance HeatPath(TM) gel family. The conformable gel easily fills gaps between components and heat sinks with minimal pressure applied, thus avoiding damage to delicate parts. Eliminated are clamping systems and tight tolerance control ...Also debuting was the DC 2406KL series of fans from NMB Technologies. These light (45 g), small (60 X 60 X 15 mm) fans produce only 19 to 34 dB of noise. Preloaded, shielded ball bearings and variable speed control via a separate heat sensor increase fan lifetime.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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