THERMATTACH(reg) T410 thermally conductive, double-sided adhesive tape is for bonding heat sinks onto plastic IC packages. The tape features a silicone-based, pressure-sensitive adhesive on one side of a 0.002-inch aluminum foil carrier. The tape's other side--a thermally loaded, high bond strength, acrylic PSA--bonds securely to metal heat sinks. Applications include bonding heat sinks to molded, plastic, ball grid array packages and other ICs that dissipate from 1 to 5W of heat.
Parker Hannifin Corp.Chomerics Div.
Booth 333277 Dragon Ct.Woburn, MA 01888FAX (781) 935-4318
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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