The IRF4000 is a 100V-rated device that integrates four HEXFET MOSFETs into a single Power MLP package for Power-Over-Ethernet applications. It complies to IEEE 802.3af specifications for networking and communications infrastructure systems. The reduced footprint can mean space savings of up to 80 percent, or 3 square inches of circuit board area in a typical 48-port board.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This radio show will show what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.