The latest in Bergquist's "S-Class" gap filling materials line, this filler offers thermal conductivity (3.6 W/m-K) and softness (Shore [00]-32), and can "wet-out" the interface surface. The latter creates less air voids on the application surface, making for more surface area contact and less interfacial resistance. It has low viscosity and good thixotropic characteristics before curing, its gel-like material filling gaps and voids, but flowing easily when dispensed or during assembly. It is a two-part material that needs no refrigeration and can cure in about 15 hours at room temperature, or in 25 min at 100C. It comes in 50 cc and 400 cc side-by-side cartridges and 1,200 cc and 10-gallon kits.
A next-generation guided ammunition system for intercepting enemy fire that Lockheed Martin is developing for the Army has hit its targets in an initial series of tests by the company.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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