This Registered ECC w/PLL, fine ball grid array-based module is a 2x128 Mx72 unit based on 512 Mb DDR SDRAM components. It has 36 128Mx4 DDR SDRAMs in fine ball grid array packages on a 184-pin DIMM (JEDEC standard). The fine ball grid array packages make for higher speed memory requirements, moving the device connections from metal leads along the side of the device to ball connections on the underside. It has clock speeds of 100, 133 and 166 MHz, Phase-lock Loop and bi-directional data strobes. It takes up about 60 percent less board space than thin small-outline package alternatives. The low-profile form factor "AD3" is 30.48 mm (1.20 inches) high. It costs $418 each in 1,000-unit volumes.
Halloween isn’t just a time for creative costumes. Thanks to the element14 online design community, the holiday this year also brings us a number of creative electronic device design ideas aimed at making your Halloween party a unique experience.
On April 15, 2010, President Barack Obama gave a major speech at the Kennedy Space Center in Florida, announcing that the US would send astronauts to Mars by the mid-2030s. But in order to do so, NASA would first need to ramp up its capabilities through missions directed toward "a series of increasingly demanding targets," i.e. asteroids.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.