This Registered ECC w/PLL, fine ball grid array-based module is a 2x128 Mx72 unit based on 512 Mb DDR SDRAM components. It has 36 128Mx4 DDR SDRAMs in fine ball grid array packages on a 184-pin DIMM (JEDEC standard). The fine ball grid array packages make for higher speed memory requirements, moving the device connections from metal leads along the side of the device to ball connections on the underside. It has clock speeds of 100, 133 and 166 MHz, Phase-lock Loop and bi-directional data strobes. It takes up about 60 percent less board space than thin small-outline package alternatives. The low-profile form factor "AD3" is 30.48 mm (1.20 inches) high. It costs $418 each in 1,000-unit volumes.
A middle school team from Rochester, Mich., has again nabbed the grand prize in the annual international Future City Competition, which drew students from 37 regions of the United States, as well as from England and China.
The word “smart” is becoming the dumbest word around. It has been applied to almost every device and system in our homes. In addition to smartphones and smart meters, we now hear about smart clothing and smart shoes, smart lights, smart homes, smart buildings, and every trendy city today has its smart city project. Just because it has a computer inside and is connected to the Web, does not mean it is smart.
Are you being paid enough? Do you want a better job? According to a recent survey Manpower released just before Engineers Week, employers and engineers don't see eye-to-eye about the state of US engineers' skills and experience.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.