This Registered ECC w/PLL, fine ball grid array-based module is a 2x128 Mx72 unit based on 512 Mb DDR SDRAM components. It has 36 128Mx4 DDR SDRAMs in fine ball grid array packages on a 184-pin DIMM (JEDEC standard). The fine ball grid array packages make for higher speed memory requirements, moving the device connections from metal leads along the side of the device to ball connections on the underside. It has clock speeds of 100, 133 and 166 MHz, Phase-lock Loop and bi-directional data strobes. It takes up about 60 percent less board space than thin small-outline package alternatives. The low-profile form factor "AD3" is 30.48 mm (1.20 inches) high. It costs $418 each in 1,000-unit volumes.
On Memorial Day, Americans remember the sacrifices the US armed forces have made, and continue to make, in service to the country. All of us should also consider the developments in technological capabilities and equipment over the years that contribute to the success of our military operations.
In order to keep in line with safety protocols, industrial networks need to be filtered in a semantic way so that only information related to diagnostics is flowing back to the vendor and that any communications that could be used for remote machine operations are suppressed.
Advanced visualization can depict an entire plant in motion, while also detailing an individual workstation. Individual products can be rendered different for each discipline involved — marketing, engineering, or suppliers.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.