This Registered ECC w/PLL, fine ball grid array-based module is a 2x128 Mx72 unit based on 512 Mb DDR SDRAM components. It has 36 128Mx4 DDR SDRAMs in fine ball grid array packages on a 184-pin DIMM (JEDEC standard). The fine ball grid array packages make for higher speed memory requirements, moving the device connections from metal leads along the side of the device to ball connections on the underside. It has clock speeds of 100, 133 and 166 MHz, Phase-lock Loop and bi-directional data strobes. It takes up about 60 percent less board space than thin small-outline package alternatives. The low-profile form factor "AD3" is 30.48 mm (1.20 inches) high. It costs $418 each in 1,000-unit volumes.
Inforbix is leveraging its CAD and product data access technology to power up a free iPad app that lets mobile users search and access engineering data.
Unlike his friends in engineering programs, blogger Jon Titus had little need for calculus except in a few of his college physical-chemistry labs and classes.
In the wake of the Chevy Volt fire investigations, sales are down, and General Motors' (GM) CEO Dan Akerson is blaming the downturn on a spate of bad publicity.
Thanks to embedded electronics, medical devices are getting smaller and smarter than ever. Pacemakers and implantable defibrillators are now able to call physicians. MRIs, CT scanners, and ultrasound machines are gaining mobility. And the venerable Band-Aid may soon be able to detect illnesses ranging from fevers to heart arrhythmias. On February 21, join Design News senior editor Charles Murray for a wide-ranging discussion, "Embedded Angles for Medical Products," which will explore the latest developments in medical electronics. The discussion will examine advances in medical device technology and offer an inside look at the embedded electronics behind it.
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