The company's new series of dual high-bandwidth SPDT and SP3T CMOS analog switches comes with 2 × 1.5 × 0.6 mm Chip Scale Packaging in each unit. They also feature low R-On between 0.5-ohm and 0.95-ohm at +2.7V supply, a 1.65V to 5.5V Vcc range, break-before-make switching, on-chip comparitors and shunt switches, high-off isolation of -42 dB to -53 dB, and a temperature range of -40 to 85C. They are designed for polyphonic ring tones, hands-free functions, FM radio, MP3/MP4 players and memo recorder applications.
This year, when Indy teams search for a competitive edge on the track, they're going to have to dig deeper into the mechanical aspects of the car than ever before in the history of the race.
A new process for laser-welding large-scale, steel-aluminum foam sandwich structures for lightweighting ships, which eliminates intermetallic phase, has been demonstrated.
The Department of Defense is designing a device that can virtually cure sepsis, an often fatal blood infection to which soldiers injured on the battlefield are prone.
A major advance in repairing composite structures combining robots and lasers bodes well for commercial aircraft such as the Boeing 787 Dreamliner and Airbus A350XWB, which contain composites in large proportions of their structures.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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