This new gap filling material offers 3.6 W/m-K thermal conductivity and Shore [00]-32 softness in one product. It is designed for automotive electronics, fiber optic telecommunications equipment, and low-pressure PCBA applications requiring thermal heat transfer of multi-height components to a universal heat sink. The 3500S35 can "wet-out" the interface surface, allowing it to reduce air voids at the application surface. This increases surface area contact and reduces interfacial resistance. In its gel-like liquid form, it fills air gaps and voids, but flows when acted upon by an external force, maintaining good thixotropic characteristics and low viscosity before curing. It is ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heatsink housing. It's a two-part material that needs no refrigeration during storage, so it can be used right away, and will cure in about 15 hrs at room temperature. After curing, it is a low-modulus elastomer that helps relieve CTE stresses during thermal cycling, yet it maintains enough modulus to prevent pump-out from the interface. Options also include 7-mil glass beads.
Inforbix is leveraging its CAD and product data access technology to power up a free iPad app that lets mobile users search and access engineering data.
Unlike his friends in engineering programs, blogger Jon Titus had little need for calculus except in a few of his college physical-chemistry labs and classes.
In the wake of the Chevy Volt fire investigations, sales are down, and General Motors' (GM) CEO Dan Akerson is blaming the downturn on a spate of bad publicity.
Thanks to embedded electronics, medical devices are getting smaller and smarter than ever. Pacemakers and implantable defibrillators are now able to call physicians. MRIs, CT scanners, and ultrasound machines are gaining mobility. And the venerable Band-Aid may soon be able to detect illnesses ranging from fevers to heart arrhythmias. On February 21, join Design News senior editor Charles Murray for a wide-ranging discussion, "Embedded Angles for Medical Products," which will explore the latest developments in medical electronics. The discussion will examine advances in medical device technology and offer an inside look at the embedded electronics behind it.
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