IC unit shipment in 2003 will grow by 15%, says market research firm IC Insights (www.icinsights.com) in its 2003 McClean forecast report. The firm cites electronic system production growth as the main reason, forecasting that the rise will reach 7%, thanks to a PC upgrade cycle after two years of decline. Cyclical model of the chip industry and strong recovery of the dollars are also favorable factors. Other projections by IC Insights include:
10% increase in electronic system production in 2004, spurred by a 3.9% global GDP growth.
Fab capacity utilization will reach 87% by the end of 2003 and 92% in 2004 due to growing unit volumes and the closure of older facilities.
Semiconductor capital spending will increase 10% in 2003. Most spending will come from 300-mm wafer fabs and equipment.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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