This rugged board is made to handle harsh environments in defense, aerospace and space applications. It offers several I/O capabilities, including ARINC-429, analog-to-digital, digital-to-analog, audio and discretes. It's perfect for general-purpose airborne applications like manned and unmanned aerial vehicles and helicopter platforms, with a new single-slot C437 accommodating I/O for a large number of sensors and actuators. There are independent power and ground domains for each of the C437's analog, digital and discrete I/O sections, isolating each signal from the other, maintaining signal integrity and minimizing cross-coupled noise. The board's new I/O components include 24 AEEC-compliant ARINC-429 channels that support both high and low-speed configurations, 60 single-ended discrete inputs, 2 differential inputs and 41 single-ended discrete outputs, plus four opto-isolated, -10 to +10V, 16-bit differential analog imputs and four -10 to +10V differential analog outputs. The board can store and play back prerecorded audio messages through an MP3 player with stereo audio output and dedicated Flash and SRAM memory. The C437 can decode and play MP3+V, WAV, PCM and MPEG 1 & 2 audio layer 3 files, plus run-time messages and uses a VMEbus bridge in a FPGA logic device, offering slave VMEbus capabilities, and support for A32/D08/D16/ D32 data transfer to and from any standard host board. The host is free to perform other tasks too, as the FPGA logic device offers full autonomous control over onboard functions. The C437 works well with moderately-powered systems, using only 14W of power. It comes in both conduction and air-cooled models, and is fully compliant with IEEE 1101.2. It has a metal thermal frame for vibration and shock control, plus added heat paths for less thermal impedance. The board has built-in self tests and integrated RTOS drivers, which include VxWorks and Integrity, for control/status and access to all the C437's I/O modules from the VMEbus host card. Other popular real-time operating system drivers are available by request.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.