SUPER SPLINE(TM) power analysis and measurement plug-in for HighRES Studio for Windows has features for every phase of reverse engineering. Through the use of smart dialog boxes, the software automates many steps in the data capture process and helps to define accurate mathematical conditions that will speed up the creation of complex surface or solid models, or a combination of both, to recreate a digital model. SUPER SPLINE streamlines data collection, data management, and the analytical review of replication jobs.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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