TelePresence’s engineering team, located in Cisco’s San Jose, CA, facility, explain the high-definition teleconferencing system
to Design News Editor-in-Chief John Dodge in Cisco’s Chicago office.
On Screen in San Jose: Kerry Hall, Text 100 Public Relations; Phil Graham, Senior Director of Engineering for Cisco; Rich Wales, Director of
Engineering, TelePresence Project; Dave Mackie, Principal Engineer, TelePresence Project In the Chicago Conference Room: John Dodge, Editor-In-Chief, Design News; Kevin Petschow, Cisco Public Relations
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This radio show will show what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.