With European directives for lead elimination in electronics coming into effect next year, RTP Co. has formulated a wide range of engineering plastic compounds that withstand the higher temperatures of lead-free soldering. Components exposed to these soldering processes have to withstand temperatures of 260C or higher. Among the RTP compounds that fit the bill are those based on PEEK, LCP, PPS, PPA, and HTN. A detailed look at the products that can stand up to high-temperature soldering can be found at www.rtpcompany.com/soldering.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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