With European directives for lead elimination in electronics coming into effect next year, RTP Co. has formulated a wide range of engineering plastic compounds that withstand the higher temperatures of lead-free soldering. Components exposed to these soldering processes have to withstand temperatures of 260C or higher. Among the RTP compounds that fit the bill are those based on PEEK, LCP, PPS, PPA, and HTN. A detailed look at the products that can stand up to high-temperature soldering can be found at www.rtpcompany.com/soldering.
In an age of globalization and rapid changes through scientific progress, two of our societies' (and economies') main concerns are to satisfy the needs and wishes of the individual and to save precious resources. Cloud computing caters to both of these.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.