Advanced Thermal Solutions (www.qats.com) has introduced the blackDIAMOND heat sink designed for passive cooling of Intel Xeon. Made from solid anodized aluminum and void of the interfacial thermal resistances in bonded heat sinks, blackDIAMOND measures at 30 mm high by 64 mm wide by 89 mm long for CPUs used in 1U packages, including the Intel P4, and the AMD Opteron and Athlon 64. The sink weighs from 144 to 162 gm, and provides thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min.
A Tokyo company, Miraisens Inc., has unveiled a device that allows users to move virtual 3D objects around and "feel" them via a vibration sensor. The device has many applications within the gaming, medical, and 3D-printing industries.
In the last few years, use of CFD in building design has increased manifolds. Computational
fluid dynamics is effective in analyzing the flow and thermal properties of air within spaces. It can be used in buildings to find the best measures for comfortable temperature at low energy use.
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