Advanced Thermal Solutions (www.qats.com) has introduced the blackDIAMOND heat sink designed for passive cooling of Intel Xeon. Made from solid anodized aluminum and void of the interfacial thermal resistances in bonded heat sinks, blackDIAMOND measures at 30 mm high by 64 mm wide by 89 mm long for CPUs used in 1U packages, including the Intel P4, and the AMD Opteron and Athlon 64. The sink weighs from 144 to 162 gm, and provides thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min.
Lantronix Inc. has expanded its line of controllers for sensor networks with the release of a rugged controller that improves management of automation systems used in a number of industries, including manufacturing, oil and gas, and chemicals.
Inspired by the hooks a parasitic worm uses to penetrate its host's intestines, the Karp Lab has invented a flexible adhesive patch covered with microneedles that adheres well to wet, soft tissues, but doesn't cause damage when removed.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is