Advanced Thermal Solutions (www.qats.com) has introduced the blackDIAMOND heat sink designed for passive cooling of Intel Xeon. Made from solid anodized aluminum and void of the interfacial thermal resistances in bonded heat sinks, blackDIAMOND measures at 30 mm high by 64 mm wide by 89 mm long for CPUs used in 1U packages, including the Intel P4, and the AMD Opteron and Athlon 64. The sink weighs from 144 to 162 gm, and provides thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min.
With major product releases coming from big names like Sony, Microsoft, and Samsung, and big investments by companies like Facebook, 2015 could be the year that virtual reality (VR) and augmented reality (AR) finally pop. Here's take a look back at some of the technologies that got us here (for better and worse).
Good engineering designs are those that work in the real world; bad designs are those that don’t. If we agree to set our egos aside and let the real world be our guide, we can resolve nearly any disagreement.
The Industrial Internet of Things is bringing a previously reluctant process industry into the wireless fold. The ability to connect smart sensors to the Internet has spiked the demand for wireless devices in process manufacturing, according to the new study from ARC Advisory Group.
If you’re developing an embedded monitoring and control application, then you’ll want to take note of the upcoming Design News Continuing Education Center class, “Embedded Development Using Microchip Microcontrollers and the CCS C Compiler."
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.