Advanced Thermal Solutions (www.qats.com) has introduced the blackDIAMOND heat sink designed for passive cooling of Intel Xeon. Made from solid anodized aluminum and void of the interfacial thermal resistances in bonded heat sinks, blackDIAMOND measures at 30 mm high by 64 mm wide by 89 mm long for CPUs used in 1U packages, including the Intel P4, and the AMD Opteron and Athlon 64. The sink weighs from 144 to 162 gm, and provides thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min.
The Industrial Internet of Things may be going off the deep end in connecting everything on the plant floor. Some machines, bearings, or conveyors simply donít need to be monitored -- even if they can be.
Wind turbines already are imposing structures that stretch high into the sky, but an engineering graduate student at the University of Notre Dame wants to make them even taller to reduce energy costs and improve efficiency.
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