Advanced Thermal Solutions (www.qats.com) has introduced the blackDIAMOND heat sink designed for passive cooling of Intel Xeon. Made from solid anodized aluminum and void of the interfacial thermal resistances in bonded heat sinks, blackDIAMOND measures at 30 mm high by 64 mm wide by 89 mm long for CPUs used in 1U packages, including the Intel P4, and the AMD Opteron and Athlon 64. The sink weighs from 144 to 162 gm, and provides thermal resistance as low as 0.28 C/W with air velocity of 800 ft/min.
As manufacturers add new technologies to their products, designing for compliance becomes more difficult. Prepare for the certification testing process. Otherwise, you increase the risk of discovering a safety issue after a product leaves the assembly line. That will cause significant time-to-market delays, be much costlier to fix, and damage your brand in the eyes of customers.
Stratasys will be exhibiting two groundbreaking large-scale additive manufacturing technologies, as well as other new products, next month at the International Manufacturing Technology Show (IMTS) in Chicago.
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
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