Austriamicrosystems (www.austriamicrosystems.com) has introduced its 50V CMOS high voltage (HV) process, a fully modular proprietary extension of the 0.35 µm CMOS technology that enables high performance/high current applications. The new purely CMOS-based HV process is achieved with 17 to 19 masks, compared with 23 to 25 in conventional processes, and allows optimum re-use of low-voltage CMOS IP.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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