Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at firstname.lastname@example.org or call (505) 844-1421.
MIT students modified a 3D printer to enable it to print more than one object and print on top of existing printed objects. All of this was made possible by modifying a Solidoodle with a height measuring laser.
This Gadget Freak Review looks at a keyless Bluetooth padlock that works with your smartphone, along with a system that tracks your sleep behavior and wakes you at the perfect time in your sleep cycle to avoid morning grogginess.
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