Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
Some cars are more reliable than others, but even the vehicles at the bottom of this year’s Consumer Reports reliability survey are vastly better than those of 20 years ago in the key areas of powertrain and hardware, experts said this week.
Many of the materials in this slideshow are resins or elastomers, plus reinforced materials, styrenics, and PLA masterbatches. Applications range from automotive and aerospace to industrial, consumer electronics and wearables, consumer goods, medical and healthcare, as well as sporting goods, and materials for protecting food and beverages.
While many larger companies are still reluctant to rely on wireless networks to transmit important information in industrial settings, there is an increasing acceptance rate of the newer, more robust wireless options that are now available.
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