Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at firstname.lastname@example.org or call (505) 844-1421.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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