Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
Using a 3D printer, CNC router, and existing powertrain components, a team of engineers is building an electric car from scratch on the floor of the International Manufacturing Technology Show in Chicago this week.
In November, a European space probe will try to land on the surface of a comet moving at about 84,000 mph and rotating with a period of 12.7 hours. Many factors make positioning the probe for the landing an engineering challenge.
NinjaFlex flexible 3D printing filament made from thermoplastic elastomers is available in a growing assortment of colors, most recently gold and silver. It's flexible and harder than you'd expect: around 85A (Shore A).
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