Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
The rear window on Ford's Lightweight Concept vehicle, based on the Fusion model, is made with a material combination devised by SABIC that saves 35% of the weight. The car's overall weight is 25% lighter than a standard production 2013 Fusion.
Major global metropolitan areas are implementing a vast number of technology, energy, transportation, and Internet projects to make the metropolis a friendlier, greener, safer, and more sustainable place to be.
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