Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at firstname.lastname@example.org or call (505) 844-1421.
A simple new chemical method for repairing and recycling notoriously difficult carbon fiber composites has been developed by the Fraunhofer Institute for Applied Polymer Research. An entire component can be completely recycled, including reclaiming its expensive carbon fibers for reuse.
In today’s connected world we are seeing the beginning of connected homes, smart grids, self-driving automobiles, drones, and many other amazing devices. Out of all the soon-to-be connected devices, which device poses the greatest dangerous to its users and society?
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.