Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
Major changes are happening in the world of 3D printing and additive manufacturing materials, machines, and software. If the industry -- and the design engineers and OEMs it serves -- are to grow, all three areas must become much more tightly integrated.
Americans spent more than $60B on their pets in 2015. Folks are definitely spending their money on more than dog food. We’re spending on things like dog spas and fancy toys, and as you can imagine, the wearables market is becoming well represented here.
Time was when sports equipment was made only from common, everyday, low-tech materials. But now sports equipment has a new, high-tech ingredient that is helping players take their game to the next level.
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