Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Design engineers need to prepare for a future in which their electronic products will use not just one or two, but possibly many user interfaces that involve touch, vision, gestures, and even eye movements.
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