Researchers at Sandia National Labs are using thermally induced voltage alteration (TIVA) and Seebeck-effect imaging for finding failures in integrated circuits. The technique allows inspection of both the front and back of integrated circuits. It uses the beam from an infrared laser that operates at wavelengths for which silicon is transparent. By heating only small portions of the integrated circuit, the researchers produce a voltage change that is biased with a current source. The reflected light image, which when registered with the TIVA image, allows identification of circuit flaws, according to developer Ed Cole. For more information, contact him at email@example.com or call (505) 844-1421.
Wearable cameras possess the power to alter our work lives, the way industrial enterprises operate, and our personal lives because of the insights they can bring from their unobtrusive, first-person point of view.
Injection molding speedster Proto Labs is now offering magnesium molding as part of its rapid manufacturing services. Called thixomolding, the new service is aimed at both prototypes and low-volume production runs.
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