IDT7MPV4060 and IDT7MPV-4145 3.3V asynchronous memory modules feature an industry-standard pinout and are pin-compatible with each other and future larger densities. The IDT7MPV-4060 module contains four 128K x 8 SRAMs in plastic small-outline J-lead (SOJ) packages. The IDT7MPV4145 module contains eight 256K x 4 SRAMs in SOJ packages. Both are 72-pin single in-line memory modules and oc-cupy 1 sq inch of board space.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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