Henkel Loctite has introduced a new VOC-free, no-clean liquid flux designed to reduce solder balling defects. Called Loctite Multicore MF300, this high activity flux targets tough-to-solder surfaces such as oxidized copper. Non-flammable and halide free, MF300 is a low residue flux that meets U.S. air quality legislation. This resin-free liquid flux can be used in conjunction with most commonly used surface preservative materials, and it passes stringent Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning. For more info, go to www.loctite.com/electronics.
A simple new chemical method for repairing and recycling notoriously difficult carbon fiber composites has been developed by the Fraunhofer Institute for Applied Polymer Research. An entire component can be completely recycled, including reclaiming its expensive carbon fibers for reuse.
In today’s connected world we are seeing the beginning of connected homes, smart grids, self-driving automobiles, drones, and many other amazing devices. Out of all the soon-to-be connected devices, which device poses the greatest dangerous to its users and society?
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