Henkel Loctite has introduced a new VOC-free, no-clean liquid flux designed to reduce solder balling defects. Called Loctite Multicore MF300, this high activity flux targets tough-to-solder surfaces such as oxidized copper. Non-flammable and halide free, MF300 is a low residue flux that meets U.S. air quality legislation. This resin-free liquid flux can be used in conjunction with most commonly used surface preservative materials, and it passes stringent Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning. For more info, go to www.loctite.com/electronics.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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