Henkel Loctite has introduced a new VOC-free, no-clean liquid flux designed to reduce solder balling defects. Called Loctite Multicore MF300, this high activity flux targets tough-to-solder surfaces such as oxidized copper. Non-flammable and halide free, MF300 is a low residue flux that meets U.S. air quality legislation. This resin-free liquid flux can be used in conjunction with most commonly used surface preservative materials, and it passes stringent Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning. For more info, go to www.loctite.com/electronics.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Design engineers need to prepare for a future in which their electronic products will use not just one or two, but possibly many user interfaces that involve touch, vision, gestures, and even eye movements.
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