Henkel Loctite has introduced a new VOC-free, no-clean liquid flux designed to reduce solder balling defects. Called Loctite Multicore MF300, this high activity flux targets tough-to-solder surfaces such as oxidized copper. Non-flammable and halide free, MF300 is a low residue flux that meets U.S. air quality legislation. This resin-free liquid flux can be used in conjunction with most commonly used surface preservative materials, and it passes stringent Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning. For more info, go to www.loctite.com/electronics.
Most machine design engineers will survey existing component manufacturers for standard linear guide products, limiting what they can do with their designs. Using extruded aluminum profile guides can customize machine designs while shrinking the bill of materials.
Practically all electronic devices today contain metals that may
be coming from conflict-ravaged African countries. And political pressures will increasingly influence how these minerals are sourced and used in products.
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