Henkel Loctite has introduced a new VOC-free, no-clean liquid flux designed to reduce solder balling defects. Called Loctite Multicore MF300, this high activity flux targets tough-to-solder surfaces such as oxidized copper. Non-flammable and halide free, MF300 is a low residue flux that meets U.S. air quality legislation. This resin-free liquid flux can be used in conjunction with most commonly used surface preservative materials, and it passes stringent Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning. For more info, go to www.loctite.com/electronics.
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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