Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Machine vision and video streaming systems are used for a variety of purposes, and each has applications for which it is best suited. This denotes that there are differences between them, and these differences can be categorized as the type of lenses used, the resolution of imaging elements, and the underlying software used to interpret the data.
Comic books long have appealed to kids as a fun way to introduce reading and art without being overly didactic. Now a software engineer and project manager from Oklahoma thinks the medium can be used to get them interested in STEM careers.
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