Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
A bold, gold, open-air coupe may not be the ticket to automotive nirvana for every consumer, but Lexus’ LF-C2 concept car certainly turned heads at the recent Los Angeles Auto Show. What’s more, it may provide a glimpse of the luxury automaker’s future.
The complexity of diesel engines means optimizing their performance requires a large amount of experimentation. Computational fluid dynamics (CFD) is a very useful and intuitive tool in this, and cold flow analysis using CFD is an ideal approach to study the flow characteristics without going into the details of chemical reactions occurring during the combustion.
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