Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
A Tokyo company, Miraisens Inc., has unveiled a device that allows users to move virtual 3D objects around and "feel" them via a vibration sensor. The device has many applications within the gaming, medical, and 3D-printing industries.
In the last few years, use of CFD in building design has increased manifolds. Computational
fluid dynamics is effective in analyzing the flow and thermal properties of air within spaces. It can be used in buildings to find the best measures for comfortable temperature at low energy use.
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