Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Producing high-quality end-production metal parts with additive manufacturing for applications like aerospace and medical requires very tightly controlled processes and materials. New standards and guidelines for machines and processes, materials, and printed parts are underway from bodies such as ASTM International.
Engineers at the University of San Diego’s Jacobs School of Engineering have designed biobatteries on commercial tattoo paper, with an anode and cathode screen-printed on and modified to harvest energy from lactate in a person’s sweat.
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