Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
A simple new chemical method for repairing and recycling notoriously difficult carbon fiber composites has been developed by the Fraunhofer Institute for Applied Polymer Research. An entire component can be completely recycled, including reclaiming its expensive carbon fibers for reuse.
In today’s connected world we are seeing the beginning of connected homes, smart grids, self-driving automobiles, drones, and many other amazing devices. Out of all the soon-to-be connected devices, which device poses the greatest dangerous to its users and society?
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