Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Days after a massive, distributed denial-of-service attack took down dozens of major websites around the country, ARM Holdings plc is rolling out a pair of new processor architectures aimed at shoring up IoT security.
Dow Chemical and several other companies have launched a program in Omaha, Neb. to divert about 36 tons of plastics from landfills in its first phase, and convert it into energy used for cement production.
Both traditional automation companies and startups are developing technologies to improve processes on the factory floor, while smart sensors and other IoT-related technologies are improving how products are handled during transport and across the supply chain.
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