Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Researchers have been working on a number of alternative chemistries to lithium-ion for next-gen batteries, silicon-air among them. However, while the technology has been viewed as promising and cost-effective, to date researchers haven’t managed to develop a battery of this chemistry with a viable running time -- until now.
Norway-based additive manufacturing company Norsk Titanium is building what it says is the first industrial-scale 3D printing plant in the world for making aerospace-grade metal components. The New York state plant will produce 400 metric tons each year of aerospace-grade, structural titanium parts.
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