Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Artificially created metamaterials are already appearing in niche applications like electronics, communications, and defense, says a new report from Lux Research. How quickly they become mainstream depends on cost-effective manufacturing methods, which will include additive manufacturing.
Sharon Glotzer and David Pine are hoping to create the first liquid hard drive with liquid nanoparticles that can store 1TB per teaspoon. They aren't the first to find potential data stores, as Harvard researchers have stored 700 TB inside a gram of DNA.
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