Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
Imagine being able to illegally download a physical product the same way you can with music and videos. That’s basically what’s happening with 3D printing and digital manufacturing, with huge repercussions in the intellectual property domain.
Ford will be the first automaker to commercially use Alcoa's tough & fast Micromill aluminum alloy process and materials, debuting on several 2016 F-150 truck components. Alcoa will also license its Micromill process and materials technology to Danieli Group.
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