Tuesday, September 14, 2000
Lisle, IL--Molex Inc. (www.molex.com) is now offering the Micro-Fit
3.0, an interconnect system designed to meet the need for a high contact density
signal or power connector. The system incorporates many features previously
found on larger power connectors. These 3.00-mm (0.118-inch) pitch connectors
are for designs requiring compact connectors carrying up to 5A of current. Dual
row test plugs are also available for continuity and are rated for 10,000 mating
cycles.
Micro-Fit
products are available in circuit sizes 2 to 24 for single and dual row,
wire-to-board, and wire-to-wire applications. The product family has more than
500 part numbers, with many retention choices including fitting nails,
solderable clips, and offset terminal retention. Additionally, the product line
offers through-hole and SMT options. The latter are available in tape and reel
packaging for robotic placement on the PCB.
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