The two-layer Thermal Clad is an Insulated Metal Substrate (IMS) which includes a shielding layer. This IMS substrate is a double-sided, ceramic-filled polymer dielectric used for surface-mount power applications. The component mounting layer may consist of 1- to 4-oz thick copper, which can provide shielding for EMI-sensitive circuits and for capacitive decoupling where high dV/dt switching is a consideration.
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The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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