The two-layer Thermal Clad is an Insulated Metal Substrate (IMS) which includes a shielding layer. This IMS substrate is a double-sided, ceramic-filled polymer dielectric used for surface-mount power applications. The component mounting layer may consist of 1- to 4-oz thick copper, which can provide shielding for EMI-sensitive circuits and for capacitive decoupling where high dV/dt switching is a consideration.
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Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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