The two-layer Thermal Clad is an Insulated Metal Substrate (IMS) which includes a shielding layer. This IMS substrate is a double-sided, ceramic-filled polymer dielectric used for surface-mount power applications. The component mounting layer may consist of 1- to 4-oz thick copper, which can provide shielding for EMI-sensitive circuits and for capacitive decoupling where high dV/dt switching is a consideration.
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