Z-LOK(TM) zero insertion force ball-grid array sockets for SMT applications are available in two new sizes. Unlike other multiple-part BGA socket assemblies, these one-piece Z-LOK sockets can be soldered into position and used with all BGA package types in the same manner as standard ZIF PGA sockets. Targeted for both development and production use, Z-LOK sockets allow repeated tool-free removal and insertion of BGA-packaged processors from and to pc-boards, with no solder ball damage or loss of signal. These sockets are compatible with all surface-mount techniques.
Wells-CTI, 2102 W. Quail Ave., Phoenix, AZ 85027, FAX (602) 780-3987.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.