Z-LOK(TM) zero insertion force ball-grid array sockets for SMT applications are available in two new sizes. Unlike other multiple-part BGA socket assemblies, these one-piece Z-LOK sockets can be soldered into position and used with all BGA package types in the same manner as standard ZIF PGA sockets. Targeted for both development and production use, Z-LOK sockets allow repeated tool-free removal and insertion of BGA-packaged processors from and to pc-boards, with no solder ball damage or loss of signal. These sockets are compatible with all surface-mount techniques.
Wells-CTI, 2102 W. Quail Ave., Phoenix, AZ 85027, FAX (602) 780-3987.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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