Z-LOK(TM) zero insertion force ball-grid array sockets for SMT applications are available in two new sizes. Unlike other multiple-part BGA socket assemblies, these one-piece Z-LOK sockets can be soldered into position and used with all BGA package types in the same manner as standard ZIF PGA sockets. Targeted for both development and production use, Z-LOK sockets allow repeated tool-free removal and insertion of BGA-packaged processors from and to pc-boards, with no solder ball damage or loss of signal. These sockets are compatible with all surface-mount techniques.
Wells-CTI, 2102 W. Quail Ave., Phoenix, AZ 85027, FAX (602) 780-3987.
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.