Z-LOK(TM) zero insertion force ball-grid array sockets for SMT applications are available in two new sizes. Unlike other multiple-part BGA socket assemblies, these one-piece Z-LOK sockets can be soldered into position and used with all BGA package types in the same manner as standard ZIF PGA sockets. Targeted for both development and production use, Z-LOK sockets allow repeated tool-free removal and insertion of BGA-packaged processors from and to pc-boards, with no solder ball damage or loss of signal. These sockets are compatible with all surface-mount techniques.
Wells-CTI, 2102 W. Quail Ave., Phoenix, AZ 85027, FAX (602) 780-3987.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
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