Z-LOK(TM) zero insertion force ball-grid array sockets for SMT applications are available in two new sizes. Unlike other multiple-part BGA socket assemblies, these one-piece Z-LOK sockets can be soldered into position and used with all BGA package types in the same manner as standard ZIF PGA sockets. Targeted for both development and production use, Z-LOK sockets allow repeated tool-free removal and insertion of BGA-packaged processors from and to pc-boards, with no solder ball damage or loss of signal. These sockets are compatible with all surface-mount techniques.
Wells-CTI, 2102 W. Quail Ave., Phoenix, AZ 85027, FAX (602) 780-3987.
Truchard will be presented the award at the 2014 Golden Mousetrap Awards ceremony during the co-located events Pacific Design & Manufacturing, MD&M West, WestPack, PLASTEC West, Electronics West, ATX West, and AeroCon.
In a bid to boost the viability of lithium-based electric car batteries, a team at Lawrence Berkeley National Laboratory has developed a chemistry that could possibly double an EV’s driving range while cutting its battery cost in half.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.