The company has introduced an RoHS-compliant version of its SOIC to DP Correct-A-Chip adapter. The new adapter is designed to provide a simple method of upgrading to an SOIC without changing the PCB layout. The top of the product accepts SOIC D or SOIC L packages, and the bottom is available in DIP pin counts from eight through 28 pins. It is available on 7.62-, 10.16- or 15.24-mm pitch centers.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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