The company has introduced an RoHS-compliant version of its SOIC to DP Correct-A-Chip adapter. The new adapter is designed to provide a simple method of upgrading to an SOIC without changing the PCB layout. The top of the product accepts SOIC D or SOIC L packages, and the bottom is available in DIP pin counts from eight through 28 pins. It is available on 7.62-, 10.16- or 15.24-mm pitch centers.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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