Researchers from the University of Cambridge have joined other European scientists in the development of semiconducting polymers that resist degrading in hot water.
Apparently, the plastic electronics survive because of inorganic-organic hybrid materials that carry platinum. According to the researchers, the material withstood near-boiling water overnight, as well as exposure to air and white light for several months.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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