Digital-microphotography technology being developed by Quadrant Engineering Plastic products promises to help predict the machining characteristics of the high-performance plastic board materials used to make CSP test sockets, which will have 4-mil separations between holes versus 10-mil separations today. "With the aid of digital-microphotography," says Quadrant Product Development Manager Richard Campbell, "various machining characteristics of high-performance plastic test sockets can be quickly and clearly observed. With this information, machining conditions can be modified to optimize productivity."
Digital healthcare devices and wearable electronic products need to be thoroughly tested, lest they live short, ignominious lives, an expert will tell attendees at UBM’s upcoming Designers of Things conference in San Jose, Calif.
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