Digital-microphotography technology being developed by Quadrant Engineering Plastic products promises to help predict the machining characteristics of the high-performance plastic board materials used to make CSP test sockets, which will have 4-mil separations between holes versus 10-mil separations today. "With the aid of digital-microphotography," says Quadrant Product Development Manager Richard Campbell, "various machining characteristics of high-performance plastic test sockets can be quickly and clearly observed. With this information, machining conditions can be modified to optimize productivity."
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