Nextreme Inc., a maker of micro-scale thermal and power management products in Research Triangle, NC, has developed a novel way to cool chips while banking energy. The company runs the cooling process in reverse, converting the heat into power circuitry that trickle-charges batteries. The process arises from an esoteric — yet basically simple — change in the way chips are packaged.
Nextreme's innovation creates a thermally active copper pillar bump. When electrical current is passed through the bump one side cools rapidly relative to the other and the bump actually generates power. While the principles behind the process have been known for a long time, they've only been possible thanks to recent advances in nanotechnology.
The DDV-IP is a two-wheeled self-balancing robot that can deliver cold beverages to thirsty folks on hot summer days. A wireless RF remote enables manual control of the device beyond the act of self-balancing. All of the features of the DDV-IP result in an effective delivery vehicle while providing entertainment to the user.
Eric Doster of iFixit talks about the most surprising aspect of the Microsoft Surface Pro 3 teardown. In a presentation at Medical Design & Manufacturing Midwest, iFixit gave the Surface Pro 3 a score of one (out of a possible 10) for repairability.
Barnacles and mussels stay attached to ship hulls and rocks because of a very sticky protein glue they secrete, holding on for a long time even underwater. Researchers at MIT took mussel glue as inspiration -- and as an ingredient -- for engineering their own sticky waterproof adhesive.
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