Nextreme Inc., a maker of micro-scale thermal and power management products in Research Triangle, NC, has developed a novel way to cool chips while banking energy. The company runs the cooling process in reverse, converting the heat into power circuitry that trickle-charges batteries. The process arises from an esoteric — yet basically simple — change in the way chips are packaged.
Nextreme's innovation creates a thermally active copper pillar bump. When electrical current is passed through the bump one side cools rapidly relative to the other and the bump actually generates power. While the principles behind the process have been known for a long time, they've only been possible thanks to recent advances in nanotechnology.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicle’s parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but that’s just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Design engineers need to prepare for a future in which their electronic products will use not just one or two, but possibly many user interfaces that involve touch, vision, gestures, and even eye movements.
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