Nextreme Inc., a maker of micro-scale thermal and power management products in Research Triangle, NC, has developed a novel way to cool chips while banking energy. The company runs the cooling process in reverse, converting the heat into power circuitry that trickle-charges batteries. The process arises from an esoteric — yet basically simple — change in the way chips are packaged.
Nextreme's innovation creates a thermally active copper pillar bump. When electrical current is passed through the bump one side cools rapidly relative to the other and the bump actually generates power. While the principles behind the process have been known for a long time, they've only been possible thanks to recent advances in nanotechnology.
A middle school team from Rochester, Mich., has again nabbed the grand prize in the annual international Future City Competition, which drew students from 37 regions of the United States, as well as from England and China.
The word “smart” is becoming the dumbest word around. It has been applied to almost every device and system in our homes. In addition to smartphones and smart meters, we now hear about smart clothing and smart shoes, smart lights, smart homes, smart buildings, and every trendy city today has its smart city project. Just because it has a computer inside and is connected to the Web, does not mean it is smart.
Are you being paid enough? Do you want a better job? According to a recent survey Manpower released just before Engineers Week, employers and engineers don't see eye-to-eye about the state of US engineers' skills and experience.
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