This 10 x 10 mm wafer uses Group4 Labs' own technology to atomically attach a single gallium nitride layer to a 25-micron-thick synthetic diamond substrate. The exterior has an atomically smooth finish with a gallium-facing surface that is epi-ready for further epitaxial deposition. It comes freestanding or on a disposable silicon wafer mount. It uses the sub-nanometer proximity of the chip's active region to the diamond to extract heat from the chip's core almost the very instant it is generated, lowering heat build-up during high-power and high-speed transistor applications. The diamond's thermal conductivity is about 3-30 times more than ordinary semiconductors, boosting a transistor array's power-density by at least 10-100 times. It sells for $500-$600 per unit based on quantity. Group4 Labs LLChttp://rbi.ims.ca/4928-637
Most machine design engineers will survey existing component manufacturers for standard linear guide products, limiting what they can do with their designs. Using extruded aluminum profile guides can customize machine designs while shrinking the bill of materials.
Practically all electronic devices today contain metals that may
be coming from conflict-ravaged African countries. And political pressures will increasingly influence how these minerals are sourced and used in products.
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