This 10 x 10 mm wafer uses Group4 Labs' own technology to atomically attach a single gallium nitride layer to a 25-micron-thick synthetic diamond substrate. The exterior has an atomically smooth finish with a gallium-facing surface that is epi-ready for further epitaxial deposition. It comes freestanding or on a disposable silicon wafer mount. It uses the sub-nanometer proximity of the chip's active region to the diamond to extract heat from the chip's core almost the very instant it is generated, lowering heat build-up during high-power and high-speed transistor applications. The diamond's thermal conductivity is about 3-30 times more than ordinary semiconductors, boosting a transistor array's power-density by at least 10-100 times. It sells for $500-$600 per unit based on quantity. Group4 Labs LLChttp://rbi.ims.ca/4928-637
Almost every automaker has had to 'pick a side' when it comes to alternative fuel options and ways to divest from a reliance on gasoline. Fiat is looking to back compressed natural gas or liquid propane as an interim solution.
Designing and filling a new type of water bottle might take less engineering work, but the description will help kids understand how science, math, and engineering influence their lives even through things that seem mundane.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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