National Technology Roadmap for Electronic Interconnections guidebook includes a section on Pure Copper Metallizations which compares the technologies of Plated and Bonded Copper (PBC), Direct Bond Copper (DBC), Active Metal Braze, and Plated Thick Films. These technologies are for power module, telecommunications, and I/C packaging applications. Guidebook discusses current technology trends, needs assessment, possible solutions, and paradigm shifts.
CirQon Technologies Corp., 1394 St. Paul Ave., Gurnee, IL 60031, FAX (847) 360-1910.
Although plastics make up only about 11% of all US municipal solid waste, many are actually more energy-dense than coal. Converting these non-recycled plastics into energy with existing technologies could reduce US coal consumption, as well as boost domestic energy reserves, says a new study.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.