National Technology Roadmap for Electronic Interconnections guidebook includes a section on Pure Copper Metallizations which compares the technologies of Plated and Bonded Copper (PBC), Direct Bond Copper (DBC), Active Metal Braze, and Plated Thick Films. These technologies are for power module, telecommunications, and I/C packaging applications. Guidebook discusses current technology trends, needs assessment, possible solutions, and paradigm shifts.
CirQon Technologies Corp., 1394 St. Paul Ave., Gurnee, IL 60031, FAX (847) 360-1910.
Advantech has launched a new series of motion-control I/O modules to meet the increased demands that come with more distributed industrial systems that require control of a growing number of axes and devices.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is