National Technology Roadmap for Electronic Interconnections guidebook includes a section on Pure Copper Metallizations which compares the technologies of Plated and Bonded Copper (PBC), Direct Bond Copper (DBC), Active Metal Braze, and Plated Thick Films. These technologies are for power module, telecommunications, and I/C packaging applications. Guidebook discusses current technology trends, needs assessment, possible solutions, and paradigm shifts.
CirQon Technologies Corp., 1394 St. Paul Ave., Gurnee, IL 60031, FAX (847) 360-1910.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.