UL Type 4 modular enclosures feature dust- and liquid-tight seals on sides, doors, and top and are for wet, non-corrosive industrial environments where equipment must be periodically hosed or washed down. The enclosures feature non-porous urethane gaskets that form a tight seal with carefully squared frame flanges. Also, silicone sealant is applied to all welded corner joints for added moisture protection. The modular frame design comes in 42 single- or double-bay sizes.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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