Wednesday, October 11, 2000
East Fishkill, NY--IBM announced yesterday what will be
the largest capital investment in company history, $5 billion--which includes
building what it calls, "the world's most technologically advanced chip-making
facility." Start of operations is set for the second half of 2002.
The new plant will combine recently developed company
technologies, including copper interconnects, silicon-on-insulator, and low-k
dielectric insulation, on 300-mm (12-inch) wafers. Such technologies enhance
chip performance while cutting power requirements. IBM also expects to be the
first to mass produce circuits with line widths below 0.10 microns.
The East Fishkill plant is roughly half the total of the capital
investment plan, which also includes expanding chip-making capacity in its
Burlington, VT, and Yasu, Japan, facilities and in Altis Semiconductor
(Corbeil-Essonnes, France), a joint venture with Infineon.
Lou Gerstner, IBM chairman and CEO said, "The world of e-business
is driving a massive build-out of the infrastructure of computing and
communications. Demand is white hot in three critical segments-chips for big
servers, chips to power Internet access devices, and chips in networking
equipment that ties everything together."
Visit http://www.ibm.com for more
information.
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