Solitron Series solid-state relays integrate a heat sink into their design and offer prolonged application life as there are no electromechanical parts due to direct copper-bonding semiconductor technology. The integrated heat sink is located on the front of the relay, making it impossible for wires connected to the relay to touch the heat sink. In addition, a much higher air capacity flows across the heat sink as they are not obstructed by other products or wiring trays.
Carlo Gavazzi Automation Components, 750 Hastings Lane, Buffalo Grove, IL 60089, FAX (800) 222-2659.
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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