Expanded Capabilities

An important aspect of system design includes permanent mounts and spacers for passive and discrete components as well as materials that simplify heat transfer and mounting of power semiconductors and integrated circuits.

ELECTRICAL ISOLATION, THERMALLY CONDUCTIVE PAD

The Bergquist Co. developed a thermally conductive, yet electrically isolating pad for mounting to the top of low stress IC applications that typically use fixed standoff or clip mounting. Rated at a thermal conductivity of 3 W/m-k, the soft gap filling material is highly conformable and maintains elastic properties for interfacing to surfaces with high roughness and or varying topography. A tacky layer on each side allows easy attachment during assembly and eliminates the need for additional adhesive that would reduce the thermal conductivity. The fiberglass-reinforced material is puncture, shear, and tear resistant. Target applications for Gap Pad include, notebook computers, server SRAMs, BGA packages, mass storage drives, power conversion, and wireline/wireless communications hardware. For more information on Bergquist's Gap Pad 3000S30, go tohttp://rbi.ims.ca/4416-661.

PASSIVE MOUNTING STRUCTURES

Bivar makes a number of designs for through-hole mounting of devices such as capacitors, resistors, transistors, and diodes. Additional designs address integrated circuits in dual in-line packages, LED mounting devices, and crystal insulators. Bivar's LED mounts show the variety of spacing options available to match design and manufacturing requirements. The mounts simplify assembly procedures where stress on LED or passive device leads could cause damage during a device's installation onto the pc board. The mounts guide the leads through dividers to prevent possible shorting. These units provide a fixture capable of controlled device elevation and perpendicular installation or for optimum LED illumination where intended. Integrally molded standoffs enable removal of process residues that may accumulate during assembly and facilitate solder joint inspection by raising the mounted LED away from the solder joint. For more information on Bivar LED mounts and spacers, go tohttp://rbi.ims.ca/4416-659.

THERMAL INTERFACE FOR AUTOMATED APPLICATION

The Bergquist Co. designed its newest Sil-Pad specifically for use in high-volume auto-dispensing/auto-placement applications. The Sil-Pad 1500ST has a thermal impedance of 0.23 C-inch²/W at 50 psi, and a tacky surface on both sides. The tack holds the material in place during assembly but allows repositioning without deformation. The material comes in bulk or sheet form in 8 mil thickness and sheet form for 12 mil thickness as well as cut shapes and sizes. Target applications include placement between power electronic devices and heatsinks in power supplies, automotive electronic control modules, motor controls, and audio amplifiers. For more information on Bergquist's Sil-Pad 1500ST, go tohttp://rbi.ims.ca/ 4416-660.