By placing both of a valve's coils on a single side, engineers from Miller Fluid Power have created a higher flow valve in a smaller package. The new valve simplifies design processes for engineers working on machines with tight packaging constraints. Because its dual solenoids are located on the same side of the valve, rather than on opposite sides, the wiring inside requires less space. As a result, it achieves high flow rates in package sizes that are said to be smaller than those of competing versions. The valve's Cvs range from 0.4 to 3.9. Miller Fluid Power: Product Code 4189.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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