The WYKO(reg) SP3000(TM) surface profiler is for advanced packaging inspection and expedites process control of large-format samples with non-contact, 3D data. The gauge-capable profiler enhances yield and improves in-line process monitoring of flip-chip packaging. The SP300 also enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.
Veeco Process Metrology, 2650 E. Elvira Rd., Tucson, AZ 85706, FAX (520) 294-1799.
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