The WYKO(reg) SP3000(TM) surface profiler is for advanced packaging inspection and expedites process control of large-format samples with non-contact, 3D data. The gauge-capable profiler enhances yield and improves in-line process monitoring of flip-chip packaging. The SP300 also enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.
Veeco Process Metrology, 2650 E. Elvira Rd., Tucson, AZ 85706, FAX (520) 294-1799.
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.