The WYKO(reg) SP3000(TM) surface profiler is for advanced packaging inspection and expedites process control of large-format samples with non-contact, 3D data. The gauge-capable profiler enhances yield and improves in-line process monitoring of flip-chip packaging. The SP300 also enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.
Veeco Process Metrology, 2650 E. Elvira Rd., Tucson, AZ 85706, FAX (520) 294-1799.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.