The WYKO(reg) SP3000(TM) surface profiler is for advanced packaging inspection and expedites process control of large-format samples with non-contact, 3D data. The gauge-capable profiler enhances yield and improves in-line process monitoring of flip-chip packaging. The SP300 also enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.
Veeco Process Metrology, 2650 E. Elvira Rd., Tucson, AZ 85706, FAX (520) 294-1799.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.