The WYKO(reg) SP3000(TM) surface profiler is for advanced packaging inspection and expedites process control of large-format samples with non-contact, 3D data. The gauge-capable profiler enhances yield and improves in-line process monitoring of flip-chip packaging. The SP300 also enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.
Veeco Process Metrology, 2650 E. Elvira Rd., Tucson, AZ 85706, FAX (520) 294-1799.
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.