IDC and JEDEC hold lead-free conference

October 5, 2007

The Association Connecting Electronics Industries (IPC) and JEDEC will hold the International Lead-Free Conference on December 3 – 5 in Austin, Texas at the Driskill.

The conference will include educational and technical programs A technical conference with tabletop displays will be held on December 4.

Presentations will include:

The Status of the IPC Survey on Lead-Free Standards by John Fisher, Interconnect Technology Analysis Inc.

Via Reliability – a Holistic Process Approach by David Wolf, Conductor Analysis Technologies Inc.

Impact Strength of Lead-Free BGA Spheres by Keith Sweatma, Nihon Superior Co.

Measuring Lead-Free Reliability of High Temperature Stabile Organic Solderability Preservatives by Michael Carano, Electrochemicals Inc.

Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur Environments by Randy Schueller, Dell Inc.

Posted by Rob Spiegel on October 5, 2007 | Comments (0)

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