IPC and Soldertec hold post-RoHS conference

January 14, 2007

Now that we’re six months past the RoHS deadline, IPC and Soldertec Global have scheduled a conference to examine compliance questions. The organizations have determined that many companies with high quality electronics products find that transferring to lead-free soldering production is not necessarily a piece of cake.

An IPC/Soldertec conference will be held in connection with the Dissemination Event by the European Union projects ELFNET, GREENROSE and LEADOUT. The conference will deliver results of more than three years high-level research into lead-free technologies.

The conference will be held in San Sebastian, Spain, on February 28 through March 2. Presentations related to RoHS will include a talk by Jean-Paul Clech who will give an in-depth review of “Lead-Free Solder Joint Reliability,” and Dr. Yoshiharu Kariya, active at the Shibaura Institute of Technology, who will present “Fatigue Characteristics of Lead-Free Solder Alloys.” A number of experts from Europe will also offer their perspectives on lead-free components.

Posted by Rob Spiegel on January 14, 2007 | Comments (1)

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August 24, 2008

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