ADVERTISEMENT
You will be redirected to your destination in 10 seconds.
Electronics Industry Search

Polling Question

Should the government bail out U.S. automakers?

  • Yes
  • No



View Previous Poll Results
Advertisement

Link This | Email this | Blog This | Comments (0)

iNEMI recommends ways to manage lead-free alternatives

July 11, 2008

The International Electronics Manufacturing Initiative (iNEMI) has outlined a set of recommendations to help electronic manufacturers manage lead-free alloy alternatives. iNEMI’s recommendations support the guidelines developed by the EMS Forum for addressing lead-free alloys.

Although SAC 305/405 have been the most commonly used lead-free alloys to date, iNEMI notes they do not meet all of the industry’s needs for all applications and that new alloy solutions continue to be introduced. iNEMI recommends the following to help manufacturers manage the use of multiple solder alloys:

  • Drive convergence of lead-free alloys
  • Develop an industry-standard assessment methodology
  • Establish performance guidelines
  • Update standards
  • Identify and differentiate alloys

iNEMI members supporting these recommendations include Agilent, Celestica, Cisco, Delphi, HP, Intel, Jabil, Motorola, Plexus, Sanmina-SCI, Sun and TI.

The iNEMI recommendations can be found at: http://thor.inemi.org/webdownload/projects/ba/Pb-Free_Alloys/Alloy_recs.pdf

Posted by Rob Spiegel on July 11, 2008 | Comments (0)
Industries:
POST A COMMENT
Display Name
captcha

Before submitting this form, please type the code above:

Advertisement
Advertisement

Design News Partner Zones

AnarkCAD/CAE Model Clean-Up: Reduce Iterative Cycles
This webinar featured research and survey results related to problems associated with preparing CAD geometry for CAE applications.  We discussed how Recipe-Based Automation can help create "just-in-time" CAE-ready geometry each time a cad model is updated. Watch the Presentation


Light Matters: Systems Level Approach to HBLED illumination applications
Its good practice to apply a systems-level approach to high-brightness LED (HBLED) illumination applications. Minimally, the system includes the optical, thermal and electrical characteristics of the of the HBLED, the lens (if any) which is built-in to its package, secondary optics such as external plastic lenses/reflectors to direct the light as your application requires and power driver electronics. Read More


Design Engineers' Portal for Sensing and Machine Safety
Whatever industry you're in, or whatever product you manufacture, the right sensors to automate your plant, and to improve your overall efficiency, quality and safety are a must. You'll find Banner Engineering to be an amazing resource of products, training and people with expertise.

Design News Partner Zone Directory »

Please visit these other Reed Business sites