Skip navigation
SKIP THIS AD >>
ADVERTISEMENT
You will be redirected to your destination in 10 seconds.
Electronics Industry Search
Advertisement
« No component shortages so far | Main | New China RoHS standards released in Chinese »

Link This | Email this | Blog This | Comments (5)

Rob Spiegel
Rob Spiegel

Tin Whisker symposium coming this spring

December 4, 2006

The Center for Advanced Life Cycle Engineering will hold an International Symposium on Tin Whiskers April 25 – 25 at the University of Maryland. The symposium will cover whisker-related failure case histories, theories of tin whisker growth, experiments and results, risk evaluation and mitigation strategies. The goal is to offer attendees the current state of knowledge on the growth, risk and mitigation strategies of tin whisker growth.

The fear of tin whisker growth remains a thorn in the side of the push toward lead-free electronic parts. With the majority of component manufacturers now using pure tin or tin-rich lead-free alloys for terminals and finishes, experts in the electronics industry are deeply concerned about product failures due to whisker growth. In the past, a small percentage of lead mixed with tin in the solder and finishes mitigated whisker growth.

The deadline for presentation proposals is January 26. Accepted proposal presenters will be notified March 2. Deadline for attendance registration is April 2.

Posted by Rob Spiegel on December 4, 2006 | Comments (5)
Industries:

December 22, 2007
In response to: Tin Whisker symposium coming this spring
Undetermined commented:

Great boys
3a995ce1ea3ff5101f4f7efadcc50913


December 22, 2007
In response to: Tin Whisker symposium coming this spring
Undetermined commented:

Hello people
c501ad5e49e17e06f2b415f6b792b717


December 22, 2007
In response to: Tin Whisker symposium coming this spring
Undetermined commented:

Yhanks you
3eb117a4ba9517e1969698b69871ae60


December 22, 2007
In response to: Tin Whisker symposium coming this spring
Undetermined commented:

Hi boys!
32b6690533e6ed3610f1b6da0e351e52


December 21, 2007
In response to: Tin Whisker symposium coming this spring
Undetermined commented:

Hi, my sites:
35644c6ec02922652c15e086c3693521

POST A COMMENT
Display Name
captcha

Before submitting this form, please type the code above:

Advertisement
Advertisement

Design News Partner Zones

AnarkCAD/CAE Model Clean-Up: Reduce Iterative Cycles
Discuss how Recipe-Based Automation can help create "just-in-time" CAE-ready geometry when CAD models are updated. Register Now

Light Matters: Systems Level Approach to HBLED illumination applications
Its good practice to apply a systems-level approach to high-brightness LED (HBLED) illumination applications. Minimally, the system includes the optical, thermal and electrical characteristics of the of the HBLED, the lens (if any) which is built-in to its package, secondary optics such as external plastic lenses/reflectors to direct the light as your application requires and power driver electronics. Read More

Design Engineers' Portal for Sensing and Machine Safety
Whatever industry you're in, or whatever product you manufacture, the right sensors to automate your plant, and to improve your overall efficiency, quality and safety are a must. You'll find Banner Engineering to be an amazing resource of products, training and people with expertise.

Design News Partner Zone Directory »

Please visit these other Reed Business sites